| Chemraz® Perfluoroelastomer
Selection Guide |
| Compound Name |
Compound Color |
Tempearture
Range (°C) |
Hardness (Shore A) |
Compression
Set (%)* |
Tensile
(psi) |
Elongation
(%) |
Modulus
50% Elongation(psi) |
Modulus
100% Elongation (psi) |
| XCD |
Black |
-15 to 300 |
74 |
32 |
2600 |
217 |
|
610 |
| High Thermal Resistance, Low Compression Set,
used for High Temperature processes, such as LPCVD, RTP, Epitaxial
Deposition, Crystal Growing, SoI Annealing |
| XRZ |
Brown |
-15 to 300 |
72 |
17 |
1250 |
255 |
|
250 |
| Excellent Resistance to both etching and
cleaning plasmas NF3 and other Fluorine based plasmas, High Thermal
Resistance, Low Compression Set |
| 513 |
White |
-30 to 210 |
80 |
25 |
1660 |
165 |
540 |
1050 |
| Good plasma resistance. Good physical
properties. Minimal contamination. Excellent performance history as
"universal product". |
| 520 |
White |
-30 to 240 |
90 |
35 |
1950 |
110 |
990 |
1780 |
| Excellent plasma resistance.
Outstanding physical properties. Low contaminants. Withstands higher sealing
loads. Excellent performance history in higher temperature
applications.
|
| 550 |
Black |
-30 to 210 |
75 |
25 |
1750 |
140 |
450 |
1150 |
| Good chemical resistance. Good physical
properties. Used where contamination requirements are less critical.
Excellent performance history. |
| 570 |
White |
-30 to 210 |
70 |
35 |
1300 |
145 |
350 |
780 |
| 571 |
White |
-30 to 210 |
80 |
35 |
1550 |
130 |
625 |
1240 |
| Very low contaminants. Extended
performance and added reliability. Good physical properties. Excellent
performance history in wet systems. |
| 592 |
White |
-30 to 240 |
85 |
36 |
2100 |
120 |
700 |
1770 |
| Excellent physical properties. Inert
filler system assures excellent resistance to plasma attack. |
| 629 |
Ivory |
-20 to 260 |
75 |
30 |
2225 |
215 |
|
610 |
| Exceptional Plasma Resistance in Oxygen
and Fluorine environments, minimal particulation, for all dry processes
except thermal processes above 260C. |
| 639 |
Ivory |
-20 to 260 |
81 |
34 |
2193 |
144 |
563 |
1303 |
| Exceptional plasma resistance in
oxygen and fluorine environments. Minimal particulation and surface
degradation. High purity, very low metallic ion content |
| 640 |
Brown |
-20 to 290 |
80 |
25 |
1735 |
165 |
|
1115 |
| Recommended for Aggressive
Plasma Systems, with enhanced resistance to Oxygen and Fluorine Plasmas for
dry wafer processing, such as CVD, HPCVD, etc. |
| 653 |
Black |
-15 to 325 |
80 |
14/26** |
1830 |
135 |
360 |
1090 |
| Excellent plasma resistance. Used
when contamination requirements are less critical. Suitable for higher
temperature applications. Superior compression set. |
| 655 |
Off-White |
-20 to 315 |
82 |
15/45*** |
1870 |
190 |
600 |
1040 |
| Service temperature up to 315° C.
Excellent balance of physical properties. Minimal contamination. Withstands
a variety of aggressive chemicals. Unlimited design flexibility. |
| 656 |
Translucent |
-30 to 232 |
70 |
24 |
1504 |
238 |
209 |
384 |
| Low Durometer FFKM material with
Low Metallic Ion content, recommended for use in CVD, Etch and diffusion
equipment applications. |
| 667 |
Burgundy |
-30 to 300 |
65 |
25 |
1400 |
270 |
140 |
240 |
| Excellent Resistance to dry O2
based plasma etch systems. Resists cracking and has improved physical
properties for Oxide Etch wafer processing systems. |
| E38 |
White |
-20 to 260 |
80 |
30 |
2200 |
150 |
410 |
1100 |
| Minimal contamination. Withstands
a variety of aggressive chemicals. Excellent physical properties. Low metal
ion content. Suitable for higher temperature applications. |