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Phone: (800) 988-2291              Fax: (408) 496-0174
Email: info@calseal.com
        
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CHEMRAZ®


Chemraz® Perfluoroelastomer Selection Guide
Compound Name Compound Color  Tempearture Range (°C) Hardness (Shore A) Compression Set (%)* Tensile
(psi)
Elongation (%) Modulus
50% Elongation(psi)
Modulus 100% Elongation (psi)
XCD Black -15 to 300 74 32 2600 217   610
High Thermal Resistance, Low Compression Set, used for High Temperature processes, such as LPCVD, RTP, Epitaxial Deposition, Crystal Growing, SoI Annealing
XRZ Brown -15 to 300 72 17 1250 255   250
Excellent Resistance to both etching and cleaning plasmas NF3 and other Fluorine based plasmas, High Thermal Resistance, Low Compression Set
513 White -30 to 210 80 25 1660 165 540 1050
Good plasma resistance. Good physical properties. Minimal contamination. Excellent performance history as "universal product".
520 White -30 to 240 90 35 1950 110 990 1780
Excellent plasma resistance. Outstanding physical properties. Low contaminants. Withstands higher sealing loads.  Excellent performance history in higher temperature applications.                                                                            
550 Black -30 to 210 75 25 1750 140 450 1150
Good chemical resistance. Good physical properties. Used where contamination requirements are less critical. Excellent performance history.
570 White -30 to 210 70 35 1300 145 350 780
571 White -30 to 210 80 35 1550 130 625 1240
       Very low contaminants. Extended performance and added reliability. Good physical properties. Excellent performance history in wet systems.
592 White -30 to 240 85 36 2100 120 700 1770
Excellent physical properties. Inert filler system assures excellent resistance to plasma attack.
629 Ivory -20 to 260 75 30 2225 215   610
Exceptional Plasma Resistance in Oxygen and Fluorine environments, minimal particulation, for all dry processes except thermal processes above 260C.
639 Ivory -20 to 260 81 34 2193 144 563 1303
Exceptional plasma resistance in oxygen and fluorine environments. Minimal particulation and surface degradation. High purity, very low metallic ion content
640 Brown -20 to 290 80 25 1735 165   1115
Recommended for  Aggressive Plasma Systems, with enhanced resistance to Oxygen and Fluorine Plasmas for dry wafer processing, such as CVD, HPCVD, etc.
653 Black -15 to 325 80 14/26** 1830 135 360 1090
Excellent plasma resistance. Used when contamination requirements are less critical. Suitable for higher temperature applications. Superior compression set.
655 Off-White -20 to 315 82 15/45*** 1870 190 600 1040
Service temperature up to 315° C. Excellent balance of physical properties. Minimal contamination. Withstands a variety of aggressive chemicals. Unlimited design flexibility.
656 Translucent -30 to 232 70 24 1504 238 209 384
Low Durometer FFKM material with Low Metallic Ion content, recommended for use in CVD, Etch and diffusion equipment applications.
667 Burgundy -30 to 300 65 25 1400 270 140 240
        Excellent Resistance to dry O2 based plasma etch systems. Resists cracking and has improved physical properties for Oxide Etch wafer processing systems.
E38 White -20 to 260 80 30 2200 150 410 1100
Minimal contamination. Withstands a variety of aggressive chemicals. Excellent physical properties. Low metal ion content. Suitable for higher temperature applications.

        70 hours @ 204°C @ 25% deflection
  ** 70 hours @ 288°C @ 25% deflection
***70 hours @ 315°C @ 25% deflection


For More Information on Perfluoroelastomers
Please Contact Us At: 1-800-988-2291
Email: info@calseal.com

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Chemraz® is a Registered Trademark of Greene Tweed and Company.